Vistron Electronics operate the Faxitron X-ray Systems in testing instrumentation used by manufacturers of electronic components, semiconductors and printed circuit boards. A microfocus X-ray source providing X-ray magnification of inspection samples and several real-time X-ray imaging packages designed to provide the flexibility for meeting specific applications. It also has a modular design so owners can start with the standard film imaging cabinet and upgrade to real-time capability at any time.
Image acquisition is achieved through the use of an X-ray image intensifier device coupled with a high resolution CCD camera. Four different intensifier packages are offered with 9", 6", and 4" image areas. The magnification factor and image resolution will vary with intensifier selection. This high resolution video image is then analyzed with an image processing system and stored for later review. Inspection samples are orientated for optimum imaging to make sure the component is the same as the component sample from the original manufacture.

Vistron Electronics will used the multi-function electronics run test machine to determine the parameter of electronic component for the technical specification, resistance of materials in any environment. A test specimen in the form of a square-section bar with coplanar notches in each face at the center, is subjected to a static tensile load in a temperature-controlled environment, for example air, water, surfactant solution. The geometry of the specimen is such that plane strain conditions are obtained and brittle failure occurs under appropriate tensile load and temperature conditions. The time for this brittle failure to occur after loading is recorded.
Test method: Full Notch creep test¡ªISO 16770
Tensile creep ---ISO 899
Test of resistance to pull out of joins between polyethylene pressure pipes and fittings¡ªISO3501 ,High accuracy and stability.

Vistron Electronics owns the hinge-with-bolt tunnel baking machine, which is outstanding in function, can make the mixture and baking process done automatically for the electronics component which is sensitive for moisture..
test for:
Adjusting range of wafer block thickness: 2.5mm-3.2mm
Demoulding method: automatic demoulding
Adjusting range of temperature: normal temperature to 180oC
Temperature error: 1oC
External dimensions (L*W*H): 8.5m*1.56m*2.4m
Others:
Equipped with 10.4 inch color touch screen for high accuracy component
display and control the setting temperature and actual temperature on the touch screen for different electronic component for purpose destination;
display and control the display, adjustment and setting of the running speed of template in different way.
Re-move the moisture from the component for the purpose to repack it without any moisture risk

Vistron Electronics uses the Rohs test equipment which is dependent on electric currents or electromagnetic fields in order to identify the Rohs status for the electronic component.
there is currently an amendment to the Rohs Directive under consideration which sets Maximum Concentration Values (MCVs) for the restricted substances and also states that the materials to be tested are 'each homogeneous material' comprising a product. This will advise our customer the exact parameter for each composition of each heavy metal volume.

Vistron Electronics use every electronics test machine to test the component which is needed. We are developing a quality acceptance test (QAT) for placement machines is to ensure that the parameters being measured will accurately represent the long-term performance of the machine, In addition to specific machine performance data, estimates of intrinsic availability, throughput and meassures of reliability should be provided based on historical data accumulated over proliminary dry cycle and set-up procedures, including mapping and calibration, the quality acceptance criteria (QAC) process begins.

Vistron Electronics will finish the final test, then we will repack the pack after moisture re-moved, which was said to be the first of the first important to insure the final quality test procedure. ?Functions include counting, stacking and packing them in a vertical, heat-sealed package that also guarantees simplified maintenance and user-friendliness with best quality control, test and inspection finish.